[PDF.95kx] High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds

High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds

[PDF.ll60] High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds

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 | #17632673 in Books |  2009-03-27 | Original language:English | PDF # 1 |  8.66 x.30 x5.91l,.45 | File type: PDF | 132 pages

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||About the Author|Xiaoning Qi, Ph.D.: Studied Electrical Engineering at Stanford University. Senior Staff Engineer at Intel Corp. on signal and power integrity for semiconductor systems. He worked on power integrity for high speed I/O, process variation, leakage

Continuous scaling of transistors combined with increased chip area results in the ratio of global wire delay to gate delay increasing at a super-linear rate. Simple RC models have become inadequate for simulation of VLSI circuits. In addition, parasitic inductance and capacitance of IC packages impose limits on the circuit performance at RF frequencies. This book presents modeling of on-chip inductance for chips with ground grids that emulate those used in real circuits...

You can specify the type of files you want, for your device.High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds   |  Xiaoning Qi. I was recommended this book by a dear friend of mine.

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