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MEMS Packaging (Emis Processing)
From The Institution of Engineering and Technology
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| #5214687 in Books | 2003-12-19 | Original language:English | PDF # 1 | 9.75 x7.50 x1.00l,1.65 | File type: PDF | 305 pages||About the Author|Tai-Ran Hsu
MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS a...
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