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Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
Gilbert B. Chapman II
[PDF.od04] Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies
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| #5866944 in Books | 2014-07-17 | Original language:English | PDF # 1 | 11.02 x.48 x8.50l,1.18 | File type: PDF | 226 pages|
Demands for improvements in aerospace and automotive energy-efficiency, performance, corrosion resistance, body stiffness and style have increased the use of adhesive bonds to help meet those demands, by providing joining technology that accommodates a wider variety of materials and design options. However, the history of adhesive bond performance clearly indicates the need for a robust method of assuring the existence of the required consistent level of adhesive bond in...
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