[PDF.53lz] Plasma Etching Processes for Interconnect Realization in VLSI
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Plasma Etching Processes for Interconnect Realization in VLSI
From ISTE Press - Elsevier
[PDF.pj72] Plasma Etching Processes for Interconnect Realization in VLSI
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| #7939846 in Books | 2015-04-22 | Original language:English | PDF # 1 | 9.02 x.31 x5.98l,.74 | File type: PDF | 128 pages||About the Author|Nicolas Posseme is a Senior Research Scientist in MIcrotechnologie & Nanotechnology and Deputy Head of Plasma Etching & Stripping in the Silicon Technologies division at the CEA-LETI Laboratory in Grenoble, France.
This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.
This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch...
You can specify the type of files you want, for your gadget.Plasma Etching Processes for Interconnect Realization in VLSI | From ISTE Press - Elsevier.Not only was the story interesting, engaging and relatable, it also teaches lessons.