[PDF.68np] Stress-Induced Phenomena in Metallization: 11th International Workshop (AIP Conference Proceedings / Materials Physics and Applications)

Stress-Induced Phenomena in Metallization: 11th International Workshop (AIP Conference Proceedings / Materials Physics and Applications)

[PDF.co16] Stress-Induced Phenomena in Metallization: 11th International Workshop (AIP Conference Proceedings / Materials Physics and Applications)

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 |  American Institute of Physics |  2010-12-20 | Original language:English | PDF # 1 |  9.50 x.80 x6.60l,1.19 | File type: PDF | 270 pages

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||From the Back Cover|One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in metallization. Stresses arising in on-chip and 3D metal interconnects and in the surrounding materials due to thermal mismatch, microstruc

One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in metallization. Stresses arising in on-chip and 3D metal interconnects and in the surrounding materials due to thermal mismatch, microstructure changes or process integration as well as electromigration can lead to degradation and failure of microelectronic products. The implementation of low dielectric constant materials into the inlaid copper backend-of-line process h...

You can specify the type of files you want, for your gadget.Stress-Induced Phenomena in Metallization: 11th International Workshop (AIP Conference Proceedings / Materials Physics and Applications)   |  From Brand: American Institute of Physics. A good, fresh read, highly recommended.

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